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Автор: Ken Kuang
Издательство: Springer
ISBN: 1441909834, 3319516965
Год: 2010-2017
Страниц: 293+186
Язык: английский
Формат: pdf
Размер: 12.3 MB
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS.