 Название: RF and Microwave Microelectronics Packaging I-II
Автор: Ken Kuang
Издательство: Springer
ISBN: 1441909834, 3319516965
Год: 2010-2017
Страниц: 293+186
Язык: английский
Формат: pdf
Размер: 12.3 MB
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
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RF and Microwave Microelectronics Packaging I-II 
