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Автор: Xing-Chang Wei
Название: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Издательство: CRC Press
Год: 2017
ISBN: 9781138033566
Язык: English
Формат: pdf
Размер: 12,6 mb
Страниц: 340
This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.