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Автор: Aida Todri-Sanial, Jean Dijon and Antonio Maffucci
Издательство: Springer
Год: 2017
Формат: PDF
Размер: 13 Мб
Язык: английский / English
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs).