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Автор: Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich
Издательство: CRC Press
Год: 2022
Страниц: 304
Язык: английский
Формат: pdf (true)
Размер: 79.9 MB
Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space.