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Название: Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
Автор: Beth Keser, Steffen Kröhnert
Издательство: Wiley-IEEE Press
Год: 2022
Страниц: 323
Язык: английский
Формат: pdf (true)
Размер: 20.3 MB
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies. In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Автор: Beth Keser, Steffen Kröhnert
Издательство: Wiley-IEEE Press
Год: 2022
Страниц: 323
Язык: английский
Формат: pdf (true)
Размер: 20.3 MB
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies. In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.