Название: Microwave and Millimeter-Wave Electronic Packaging
Автор: Rick Sturdivant
Издательство: Artech House
Год: 2013
ISBN: 9781608076970
Формат: pdf
Страниц: 261
Размер: 16,3 mb
Язык: English

Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs.